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November 2003

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Subject:
Gold 'bumps' on pads? How is it done?
From:
"Brooks,Bill" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Nov 2003 13:32:20 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
Hi,
I am looking at a sample board done with 'gold bumps' in the centers of the
pads to allow surface to surface mounting of 2 boards. Anyone have a 'clue'
how this is done? How it gets used?
I have not seen this before and would like to learn about it.

Bill Brooks
PCB Design Engineer , C.I.D., C.I.I.

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