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November 2003

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Subject:
From:
"Croslin, Robert" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 14 Nov 2003 15:11:16 -0500
Content-Type:
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text/plain (63 lines)
Dann, we've done more than our share of these as our stuff gets built for 20
- 25 years and obsolescence is an issue, but what we've used for pins are
strip style headers on .10 centers.  That way, it all fits within normal
processes.  In looking at your picture, it almost looks like the pins may
have been on a band that was broken away after they were soldered.  It would
almost certainly have to be fixture to hold alignment, but this is the first
time I've seen those pins.  Any chance you could use a strip header?  You do
have to watch the height, though.

Bob Croslin
Nielsen Media Research


-----Original Message-----
From: d. terstegge [mailto:[log in to unmask]]
Sent: Friday, November 14, 2003 9:01 AM
To: [log in to unmask]
Subject: [TN] Replacing a DIP package


Hi Technet,

http://www.parallax.com/images/prod_jpg/bs2p24-ic.jpg is a picture of a
tiny pcb assembly that can be wavesoldered onto a motherboard almost
like a normal through-hole package.  Due to an obsolescense problem we
are thinking about replacing a 22-pins DIP-package by a construction
similar to what's in the picture.
Does anyone know what technology to use to get the sidepins connected
to the substrate, and does this fit within a normal PCB Assembly
process? Also any  ideas about alternative solution are more then
welcome.

Best regards!

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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