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November 2003

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Subject:
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 11 Nov 2003 00:49:40 -0500
Content-Type:
text/plain
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>  -----Original Message-----
> From:         Jackie Stewart
> Sent: Tuesday, November 11, 2003 12:45 AM
> To:   Leland Woodall
> Subject:      FW: Paste Height Measurements
>
>
>
>  -----Original Message-----
> From:         Jackie Stewart
> Sent: Tuesday, November 11, 2003 12:44 AM
> To:   [log in to unmask]
> Subject:      Paste Height Measurements
>
> All,
>
> Can you recommend a tool or technique for our operators to use in
> monitoring the solder paste height on a stencil?
>
> We have an LSM and currently check all four corners of a board every hour.
> This method, however, doesn't seem to be adequate.  We've thought about
> increasing the frequency, but are open to other suggestions.
>
> Metal sqeegees would probably minimize our problem, but much work would
> have to be performed before qualifying such a change in our process.
>
> Thanks in advance for your advice.
>
> Jackie Stewart
> Process Engineer
> Keihin Carolina System Technology, Inc.

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