I will be unable to attend the planning meeting in person, but will be
available for telephone discussion if desired.
If you are all interested, I will volunteer to develop and provide a
section on embedded passives cost modeling to be used for the workshop.
Thirty minutes to an hour would probably be adequate.
Thanks -
Chet Palesko
Answer Systems North America
Phone : (512) - 402 - 9943
Email: [log in to unmask]
-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Tuesday, November 18, 2003 5:08 PM
To: [log in to unmask]
Subject: [EM] Embedded Passives Workshop Planning Meeting
Colleagues,
This is a copy of an e-mail message which Dieter Bergman of IPC sent to
the team developing IPC Embedded Passive Workshops. This is an FYI that
the meeting is open to all those within [log in to unmask] who wish to
attend. As indicated in Dieter's message, those interested should
contact Jeanne Cooney here at IPC - [log in to unmask]
Regards,
John Perry
Technical Project Manager
IPC
[log in to unmask]
1-847-790-5318
------------------------------------------------------------------------
---------------
To: Team members of Two Day Embedded Passive Workshop activity
Subject: Embedded Passive workshop planning meeting
Dear Colleagues,
A two-day planning meeting has been scheduled at IPC headquarters on
December 11-12, 2003. The purpose of the meeting is to develop the
detailed agenda and the resource material that will be used in a two-day
workshop that covers embedded passive and active components contained
inside a multilayer structure.
We already have a preliminary outline that was started several months
ago and some experience with three hour workshops. The outline is
embedded below and includes comments already received from Denny Fritz.
If we get some thinking done ahead of time, and maybe more proposed
agendas, we could save time on Thursday morning, the 11th. After the
outline has been completed, we will review the resource material that
has been made available and should be included in the workshop.
Our goal is to build on the three hour workshop experience in 2004 and
provide the industry a product that will help attendees of this workshop
understand better the principles of designing and fabricating embedded
products.
The meeting will start at 8:00 am on Thursday, December 11th. We hope to
complete our deliberations by Friday at 3:00 pm. We have attached a map
and a list of hotels in the area and ask that you make your own travel
arrangements.
If you have any questions, please contact [log in to unmask] Please
also let her know if you will be attending.
Cordially,
Dieter Bergman
Dieter Bergman
IPC-Association Connecting Electronics Industries
2215 Sanders Road
Northbrook, IL 60062-6135
Tel: 847-790-5339
Main fax: 847-509-9798
Direct Fax: 847-504-2339
************************************************************************
********************************************
Tentative Agenda - Embedded Passive Technology Workshop
First day
8:00 am REGISTRATION AND PRESESSION COFFEE BREAK
8:30 am WELCOME AND OPENING REMARKS
INTRODUCTION TO IPC & WORKSHOP........ Bergman
Do we want an overview of embedded passives here - like the first hour
of the 3 hour course we now have?
DESIGN PARAMETERS..................Snogren
Can Richard alone do this? I think Mike Fitts of Mentor is also invited
now, and he can do this with us.
I would add here the library information from vendors of materials that
is included in the design programs
I think this will take a half day at least, and do we want to present
this early in the seminar? Maybe materials with slash sheets first, so
that info can be used in design section.
COFFEE BREAK
LAMINATE /PLATING MATERIAL CONSIDERATIONS....Fritz
PRINTED BOARD IMAGING...............Fisher
I think this may include the scaling factors that board shops need to
put the image the right place. Do we need a separate discussion on this
very topic? Richard can tell us this for sure.
LUNCH
INFLUENCE OF HOLE TECHNOLOGY........Bergman
I suggest we emphasize microvia technology here
COMPONENT POSITIONING CONCERNS.....Snogren
Do we need an OEM to answer this question??
REFRESHMENT BREAK
SOLDER MASK ISSUES AND REQUIRMENTS....Fritz
I don't see this as too important. We see few "integral components"
coming on the board surface
RIGID PRINTED BOARDS INCLUDING HDI.....Fisher
Do we mean sub boards, or considerations of distributed capacitance
layers
TOUR OF CRANE FACILITY or Merix facility +ESI facility
5:00 pm ADJOURNMENT
TIMES ARE APPROXIMATE
* Coffee Breaks at approximately 10:15 a.m. and 3:15 p.m.
* Break for Lunch from approximately 12:30 p.m. to 1:30 p.m.
(over)
Second Day
8:30 am PRESESSION COFFEE BREAK
Q and A SESSION
LAND PATTERN DEVELOPMENT..........Bergman
How is this different from scaling factors? Is there consideration
here of embedding discretes into the board, and having land patterns on
the inner layers?
VISUAL/DIMENSIONAL EXAMINATION......Snogren
I am not sure what is meant here.
COFFEE BREAK
LAMINATION AND STRUCTURAL INTEGRITY....Fritz
I can compile and assess the data we know about simulated assembly and
life testing. I don't know anything about lamination, except that there
is a bit of drift from all components being embedded
OEM PERFORMANCE REQUIREMENTS .......Fisher
OK- we can assess what we know from Motorola, and 3 in NIST - Nortel,
Compaq/HP, and Delphi. Maybe get some Omega ply references
LUNCH
DATA TRANSFER TECHNIQUES.........Bergman
QUALITY ASSESSMENT..............Snogren
Is anything available on AOI here?
REFRESHMENT BREAK
SAMPLING PLANS..................Fritz
Would suggest this be an overview of standards documents, including the
sampling/testing requirements being proposed in IPC 4902 materials for
Embedded Passives and accompanying slash sheets of materials
ELECTRICAL TESTING...............Fisher
4:00 pm RECAP/QUESTIONS & ANSWERS
4:30 pm ADJOURNMENT
TIMES ARE APPROXIMATE
* Coffee Breaks at approximately 10:00 a.m. and 3:00 p.m.
* Break for Lunch 12:15 p.m. to 1:15 p.m.
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