We supply smask artwork at the same size as the pads and include a note that
no mask is to touch the pads. This allows the fabricator to do what he
needs to do to make sure the mask doesn't encroach pads we want cleared.
Where we WANT encroachment, we spec the smask at _hole_ size and include a
note that the mask is to be adjusted in those cases so no material runs into
the holes.
--
George Patrick
Tektronix, Inc.
Central Engineering, PCB Design Group
P.O. Box 500, M/S 39-512
Beaverton, OR 97077-0001
Phone: 503-627-5272 Fax: 503-627-5587
http://www.tektronix.com <http://www.tektronix.com>
http://www.pcb-designer.com
It's my opinion, not Tektronix'
-----Original Message-----
From: Jeff Seeger [mailto:[log in to unmask]]
Sent: Wednesday, November 05, 2003 6:46 AM
To: [log in to unmask]
Subject: [DC] soldermask methods poll
,
Hi all,
Posting this for a friend who is not a subscriber:
I am in the middle of a discussion/debate with assemblers on one
side and designers on the other.
The question is:
As a Designer, what would you prefer to send to the fabricator
for the soldermask features?
either
A) 1:1? (Soldermask clearance same as the holesize, padsize,
surfacemount, or clearanced feature size)
or
B) Clearance set at some value over the pad/feature/SMT size?
(Like 3 mils per side)
Thanks for any and all responses,
David Hoover
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
President, Greater Boston Chapter, IPC Designer's Council
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