Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Sun, 2 Nov 2003 09:15:44 +0200 |
Content-Type: | text/plain |
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I agree, The industry need more time, more experiments and experience
before changing the land patterns.
Logically, because of the issues such as: whiskers phenomena solder joints
strength, thermal aspects, We have to be carful in HDI PCBs, make pads
without corners big as possible within the design rules, and moving towards
high Tg. materials in multilayers.
Best Regards
ROKAH Reuven
MA/NY DDave
<[log in to unmask] To: [log in to unmask]
M> cc:
Sent by: Subject: Re: [LF] New to the group : Lead free landpatterns
Leadfree question
<[log in to unmask]
G>
01/11/03 08:01
AM
Please respond
to "(Leadfree
Electronics
Assembly
Forum)"; Please
respond to MA/NY
DDave
Hi Rene,
I see you have received really good answers from ThomasA and UK-BobbyW.
The IPC will not be able to standardize land patterns until the industry
which will be Lead Free becomes stable on many manufacturing and supplier
fronts. That is just the way the IPC works as a broad industry
manufacturing collaborative.
Mr IPC-Reliability WernerE can correct me.
Geez, Where is Mr Reliability.
YiEngr, MA/NY DDave
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