> Hello all,
        Sorry for the missing information:  As we are starting the
development of a long-term cost sensitive project. The product will be
characterized by thick PCB (2.7 to 3.3 mm), aspect ration 10:1 and data rate
of over 3 GB.
>  , I have to place in the design guidelines requirements for the lead free
> technology.
>
> Can you please advise:
> 1.    Which laminates will survive dual-reflow + 2 repair thermal cycle?
> We are looking for the cheapest possible materials, preferably based on
> glass-epoxy.
> 2.    Are the compliant laminate already in stable production? If not -
> when?
> 3.    Do these laminates have the same electrical characteristics
> (breakdown voltage, electrical losses, Dk) as the FR4?
> 4.    Do the new pastes have different specifications from the stencil?
> pads design?
>
> Regards
> Ofer Cohen
> Manager - Quality Assurance, Reliability and Production Technologies
> Seabridge LTD
>
>

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------