We did some work about 10 years ago with Sn-3.5Ag on thick film substrates,
for your reference -
D. Shangguan, A. Achari, and W. Green, Application of Lead-Free Eutectic
Sn-Ag Solder in No-Clean Thick Film Electronic Modules. IEEE Transactions
on Components, Packaging, and Manufacturing Technology - Part B, 17(4)
(1994), pp. 603-611.
Regards,
Dongkai Shangguan, Ph.D.
Director - Advanced Process Technology
FLEXTRONICS
2090 Fortune Drive, San Jose, CA 95131
Phone: (408) 428 1336 Fax: (408) 576 7988
[log in to unmask]
-----Original Message-----
From: Mike Fenner [mailto:[log in to unmask]]
Sent: Tuesday, November 25, 2003 5:24 AM
To: [log in to unmask]
Subject: Re: [LF] Reliability data for 99.7Sn/0.7Cu soldering Pd/Ag
thick film board
I think it highly likely that this alloy would dissolve the Pd/Ag
metallisation completely, making reliability testing somewhat difficult
but fortunately unnecessary.
IF you are looking for a PB-free solution for soldering PdAg thick film
inks you might like to contact me off line as we might have some ideas.
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Zhang Yong Ming
Sent: Monday, November 24, 2003 5:29 AM
To: [log in to unmask]
Subject: [LF] Reliability data for 99.7Sn/0.7Cu soldering Pd/Ag thick
film board
Hi all,
Are there any reliability data about 99.3Sn/0.7Cu lead free solder
soldering to Pd/Ag plating thick film board?
Appreciate if someone can provide the information.
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