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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 18 Nov 2003 10:46:42 -0800 |
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Dear Techneters:
I am looking for recommendations on reliability testing (thermal cycling, vibration, etc.) of BGAs AFTER being soldered to a PCB.
Are there any standards that include such things as heating cycles (like a minimum of 5,000 cycles), ball-ball leakage and the like? Can anyone share this kind of information that they may have gotten from an IC vendor or by other companies that can be/should be used as a benchmark?
Regards
Bob Wettermann
BEST Inc
Bob Wettermann
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