Hi Eddie,

IPC/EIA J-STD001C asks for removal of gold from (through-hole)
component leads when the thickness of the gold layer is above 2.5
microns, to prevent problems with embrittlement. Thickness on an ENIG
board is typically around 0.05 micron, resulting in a gold content in
the joints far below what's considered dangerous.  Perhaps a mouseclick
on "conductor finishing" on the mainpage of my http://www.smtinfo.net
site will get you some better info.

Best regards,

Daan Terstegge
Thales Communications
Unclassified mail

>>> Eddie Rocha <[log in to unmask]> 10/06/03 11:51pm >>>
Does anybody have data or literature which shows that solder joint
embrittlement is not an issue when ENIG is used? I have a customer
that needs this supporting data before he can allow us to use ENIG. Is
this embrittlement issue related only to a certain thickness of gold?
I'd appreciate any feedback on this topic.
thanks,

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