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October 2003

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Subject:
Re: ENIG solder joint embrittlement
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Oct 2003 22:30:45 -0700
Content-Type:
text/plain
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text/plain (41 lines) 
Eddie,

Your customer may be concerned about "Black Pad" and/or "nickel"
embrittlement. It is soldering the nickel layer that is a primary concern.
The very thin layer of gold is there to slow down oxidation of the nickel.

David A. Douthit
Manager
LoCan LLC



Eddie Rocha wrote:

> Does anybody have data or literature which shows that solder joint
> embrittlement is not an issue when ENIG is used? I have a customer
> that needs this supporting data before he can allow us to use ENIG. Is
> this embrittlement issue related only to a certain thickness of gold?
> I'd appreciate any feedback on this topic.
> thanks,
>
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