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October 2003

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Subject:
Re: Non Round BGA Pads
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 6 Oct 2003 22:39:13 EDT
Content-Type:
text/plain
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text/plain (28 lines) 
Hi Brian, 
At Bell Labs we used recangular pads besides round ones to increase density, 
not for inspection. A side benefit was a slight increase in reliability. For a 
reference look at:
Engelmaier, W., "BGA and CGA Solder Attachments: Results of Low-Acceleration 
Test and Analysis," Proc. Surface Mount International Conf., San Jose, CA, 
August 1995, pp. 344-358; also in Proc. NEPCON West ‘96, Anaheim, CA, February 
1996, pp. 1020-1036. 

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com 

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