This question looks exactly as one asked a few weeks ago.



> -----Original Message-----
> From: Macko, Joe @ IEC [SMTP:[log in to unmask]]
> Sent: Friday, October 03, 2003 11:33 AM
> To:   [log in to unmask]
> Subject:      [TN] BGA retention
>
> Fellow Techs,
>
> We are assembling a double sided board with BGAs on both sides.  One board
> seems to be having a problem with a 21 mm sq. pbga that is initial
> installed on the 1st side and then goes through the reflow oven again,
> upside down during the 2nd side reflow.  It looks like the bga is dropping
> slightly when it goes through the reflow oven for a second time, upside
> down.
>
> Does anyone have any ideas on how to either temporarily or permanently
> secure the bga in place after the 1st side reflow so the bga does not pull
> away from the board slightly during the 2nd side reflow?  Tacking the
> corners with some type of epoxy that would not affect long term
> reliability?  thanks
>
> joe
>
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