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October 2003

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Subject:
From:
Mark Austin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 31 Oct 2003 08:21:00 +0000
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I have read a document produced by AIM which gives evidence of possible
reliability problems when soldering Leaded BGA's with Lead Free paste. I
would guess the reverse is true if you have a lead free BGA and lead paste
and you take the profile over the lead free reflow temperature. Apparently
the extra lead migrates through the joint and collects at the last point to
cool resulting in a weak joint. You should be able to find the document on
the AIM site, if not mail me off-line and I will forward you the document.

Mark Austin
Process Engineer
ACW Technology Ltd
UK
[log in to unmask]

===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
30/10/03 23:09
>hi all
>
>Just a question to all the BGA experts out there ;)
>
>How would you tackle BGA assembly where there are both Pb Free BGAs and the
>standard Sn/Pb BGAs on the same board?
>Our paste manufacture recommended we maximise the peak as far as possible
>but my concern is how would this affect the other BGAs (not Pb Free) on the
>board. Would this degrade the joint due to excess heat and possibly longer
>time above Eutectic for other components? What would be a good compromise
>peak temperature to obtain a reliable joint?
>
>Has anyone done something like this that could share their experience.
>Thank you in advance
>
>
>kind Rgds
>Dennis
>
>
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