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October 2003

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Oct 2003 08:33:11 -0600
Content-Type:
text/plain
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text/plain (18 lines)
What do you mean by excessive drying? do you mean final cure? By the time
the panel gets to dry (either post-develop drying, or final cure) there
should not be any mask there at all...if you're talking drying after copper
plate (leaving moisture or residuals) then again, this would cause adhesion
issues...your comments are puzzling...

Franklin

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