Hi folks! One additional reference source which is very useful is the
American Welding Society Soldering Handbook (ISBN 0-87171-618-6), author
Paul Vianco. Its one of the low cost, well organized references I think
folks should have in their libraries. The Handbook is full of references
and does a good job of discussing solder properties, solder metallurgy,
soldering technology and solder processes. There a several sections which
discuss gold embrittlement phenomena. Good Luck.
Dave Hillman
Rockwell Collins
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Tegehall Per-Erik
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Sent by: TechNet Subject: Re: [TN] Sources of Detailed information on gold in a solder joint
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Tegehall Per-Erik
Rich,
The failure mechanism will differ depending on if you solder to copper or
to nickel. If you solder to copper, you mayget gold embrittlement of the
solder joint if the gold concentration is higher than 3-5% (that's the
failure mechanism that is dealt with in Klein-Wassink and Manko). On
nickel, you may get embrittlement of the solder joint at much lower gold
concentrations (down to 0.2%) due to the formation of a AuNiSn
intermetallic layer during aging. For this latter type of failure
mechansim, you can find detailed information in the following references:
A. Eslambolchi, P. Johnson, M. Kaufmann och Z. Mei, Electroless
Ni/Immersion Au Evaluation ? Final Program Report, Electronic Assembly
Development Center, Hewlett-Packard, Palo Alto, 1998.<?xml:namespace prefix
= o ns = "urn:schemas-microsoft-com:office:office" />
K. Zeng och K.N. Tu, Six Cases of Reliability Study of Pb-free Solder
Joints in Electronic Packaging Technology, Materials Science and
Engineering R, Vol. 38, 2002, sida 55-105.
A. Zribi, R.R. Chromik, R. Presthus, K. Teed, L. Zavalij, J. DeVita, J.
Tova, E.J. Cotts, J.A. Clum, R. Erich, A. Primavera, G. Westby, R.J. Coyle
och G.M. Wenger, Solder Metallization Interdiffusion in Microelectronic
Interconnects, IEEE Trans. on Comp. and Pack. Techn. Vol. 23, Nr. 2, 2000,
sida 383-387.
R. Darveaux, K. Banerji, A. Mawer och G. Dody, Reliability of Plastic Ball
Grid Array Assembly, J.H. Lau (Ed.), Ball Grid Array Technology,
McGraw-Hill, Inc., 1995, Kapitel 13.
A.M Minor och J.W. Morris, Jr., Growth of Au-Ni-Sn Intermetallic Compound
on the Solder-Substrate Interface After Aging, Metall. Mater. Trans, A,
31A, 2000, p. 789. http://www.lbl.gov/morris/private/papers.html
A.M. Minor och J.W. Morris, Inhibiting Growth of the Au(subscript: 0.5)Ni
(subscript: 0.5)Sn(subscript: 4) Intermetallic Layer in Pb-Sn Solder Joints
Reflowed on Au/Ni Metallization, Journal of Electronic Materials, October
2000, Vol. 29, Issue 10, sida 1170-1174.
http://www.lbl.gov/morris/private/papers.html
Per-Erik Tegehall
IVF, Sweden
-----Ursprungligt meddelande-----
Från: Richard Kraszewski [mailto:[log in to unmask]]
Skickat: den 24 oktober 2003 17:28
Till: [log in to unmask]
Ämne: [TN] Sources of Detailed information on gold in a solder joint
Looking for detailed information concerning gold in solder joints.
Specifically concerning details of the failure mechanisms, and
location of intermetallics within the joints.
Something more detailed than what you'll find in Klein-Wassink or
Manko.
Rich Kraszewski
Advanced Manufacturing Engineer - KEG
1038 E. 15th Street, Jasper, IN 47546
Phone: 812.634.4281
Pager: 812.481.3492
E-mail: [log in to unmask]
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