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Subject:	Re: Design for IPC solderability coupon "S"
From:	Dave Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 28 Oct 2003 08:05:57 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (146 lines)

Hi Debbie! The solderability coupon in IPC-2221 comes from the
IPC-JSTD-003A specification. The coupon "internal structure" should
representative of the printed wiring board it is associated with (it
doesn't have to be exact but the closer the replication the more applicable
the test results) - that way when a solderability test is conducted the
test results should mimic the production assembly response. Good Luck.

Dave



                      "Deborah Schepis"
                      <Deborah.Schepis@        To:       "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
                      eitny.com>               cc:
                                               Subject:  Re: [TN] Design for IPC solderability coupon "S"
                      10/27/2003 09:20
                      AM







My sources tell me it's in IPC-2221, Figure 12-18, pg. 92.

Deborah S. Schepis
Quality Engineer
Endicott Interconnect Technologies
(607) 755-3152
email: [log in to unmask]



                      Dave Hillman

                      <ddhillma@ROCKWELLC        To:       [log in to unmask]

                      OLLINS.COM>                cc:

                      Sent by: TechNet           Subject:  Re: [TN] Design
for IPC solderability coupon "S"
                      <[log in to unmask]>



                      10/27/2003 09:50 AM

                      Please respond to

                      "TechNet E-Mail

                      Forum."; Please

                      respond to ddhillma







HI Debbie! What IPC document contains the 4 x10 "S" Coupon?

Dave Hillman
Rockwell Collins
[log in to unmask]



                      Deborah Schepis
                      <Deborah.Schepis@        To:       [log in to unmask]
                      EITNY.COM>               cc:
                      Sent by: TechNet         Subject:  [TN] Design for
IPC solderability coupon "S"
                      <[log in to unmask]>


                      10/27/2003 07:37
                      AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      Deborah Schepis






Hello again!

We are having some trouble determining what the internal layers (power and
signal) for the 4x10 "S" coupon should look like.  Are there just unused
lands or are there clearances?  We can't find this in any of the
documentation.  Any guidance would be appreciated.

Thanks,

Debbie

Deborah S. Schepis
Quality Engineer
Endicott Interconnect Technologies
(607) 755-3152
email: [log in to unmask]

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for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
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To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
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