TECHNET Archives

October 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Dave Chapman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 24 Oct 2003 15:12:32 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (143 lines)
ok, so today I had 10 boards with vias under the BGA and solder came up from
wave solder machine and caused 4 shorts. Should the vias have been masked
closed from the bottom? Should the metal ring at the top of the via
(topside) have LPI over it so solder wont stick to it even if it does come
up through the via hole? Should the bottom via ring have LPI over it so
solder wont stick to it?
Forget about process changes we will make those as far as speed and heat at
wavesolder machine. What should I close if anything to stop the solder from
getting up under the BGA's
Dave C.

-----Original Message-----
From: Franklin D Asbell [mailto:[log in to unmask]]
Sent: Friday, October 24, 2003 3:12 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning of via holes under components


Curious, plugging with "solder" from only one side...what process is used
for this??? Do you mean solder mask???

Franklin


----- Original Message -----
From: "David Douthit" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, October 24, 2003 1:21 PM
Subject: Re: [TN] Cleaning of via holes under components


> Brian,
>
> Well said (again!!)
>
> David A. Douthit
> Manager
> LoCan LLC
>
> Brian Ellis wrote:
>
> > I'm a proponent of plugging -- with solder! Not only does it stop the
> > contamination problem, but it is electrically and thermally desirable,
> > as well. However, it should be done from only one side unless you like
> > to see miniature Krakatoas.
> >
> > Brian
> >
> > Paul Baine wrote:
> > > Hello,
> > >
> > > One of our Design Engineers is designing a surface mount PCB
> > > assembly and would prefer not to have the via holes solder mask
> > > tented.  However, he is concerned that, if he does not call up
> > > solder mask tenting on his bare PCB drawing, foreign matter could
> > > find its way into a via hole and, if a component (e.g. an IC) was
> > > mounted over the via hole, the foreign matter might not be removed
> > > during the cleaning process.
> > >
> > > Has anyone had experience with this situation?  I would appreciate
> > > any help you could give me.
> > >
> > > Thanks very much in advance.
> > >
> > > Paul Baine
> > > Q.A. Manager
> > > C-Tech Ltd.
> > > Cornwall, Ontario, Canada
> > >
> > > ---------------------------------------------------
> > > Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> > > To unsubscribe, send a message to [log in to unmask] with following text
in
> > > the BODY (NOT the subject field): SIGNOFF Technet
> > > To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> > > To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> > > Search the archives of previous posts at:
http://listserv.ipc.org/archives
> > > Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information,
or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> > > -----------------------------------------------------
> > >
> > >
> >
> > ---------------------------------------------------
> > Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> > To unsubscribe, send a message to [log in to unmask] with following text
in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> > To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> > Search the archives of previous posts at:
http://listserv.ipc.org/archives
> > Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information,
or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> > -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2