Hello,

One of our Design Engineers is designing a surface mount PCB
assembly and would prefer not to have the via holes solder mask
tented.  However, he is concerned that, if he does not call up
solder mask tenting on his bare PCB drawing, foreign matter could
find its way into a via hole and, if a component (e.g. an IC) was
mounted over the via hole, the foreign matter might not be removed
during the cleaning process.

Has anyone had experience with this situation?  I would appreciate
any help you could give me.

Thanks very much in advance.

Paul Baine
Q.A. Manager
C-Tech Ltd.
Cornwall, Ontario, Canada

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