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October 2003

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Subject:
Re: SMT Glue and Paste with Wave solder
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Oct 2003 11:28:42 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (249 lines) 
        Carl:
        That is a big window. Did you get an angle or small window that was
the most predominant?
        Regards,
        Ramon

> -----Original Message-----
> From: Carlr Ray [SMTP:[log in to unmask]]
> Sent: Tuesday, October 21, 2003 12:56 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] SMT Glue and Paste with Wave solder
>
> Ramon,
>  I have the seen several variations from 10 - 35 degrees. I also
> noticed that it depends on the design of the board and technologies used
> in most cases.
>
> >>> "Dehoyos, Ramon" <[log in to unmask]> 10/21/2003 11:37:58 AM
> >>>
>
>         Carl:
>         That is what I understood. My question was about the board or
> boards
> that you did your DOE on.
>         Regards,
>         Ramon
> > -----Original Message-----
> > From: Carlr Ray [SMTP:[log in to unmask]]
> > Sent: Tuesday, October 21, 2003 12:23 PM
> > To:   [log in to unmask]; Dehoyos, Ramon
> > Subject:      Re: [TN] SMT Glue and Paste with Wave solder
> >
> > Ramon,
> >  The pallet I was referring to would be used to determine the
> > rotational angle of the product as it is introduce to the wave
> solder.
> >
> > >>> [log in to unmask] 10/21/2003 11:05:59 AM >>>
> >         Carl:
> >                 Did you find this angle to be around 16 degrees? If
> you
> > can
> > answer this question.
> >                 Regards,
> >                 Ramon
> >
> > > -----Original Message-----
> > > From: Carlr Ray [SMTP:[log in to unmask]]
> > > Sent: Tuesday, October 21, 2003 10:44 AM
> > > To:   [log in to unmask]
> > > Subject:      Re: [TN] SMT Glue and Paste with Wave solder
> > >
> > > Richard,
> > >  As an option to try to optimize your wave process have you
> > considered
> > > using a rotary wave pallet? I have used the process of
> > > glue/paste/place/reflow/wave and had good success but depending on
> > the
> > > design of the pcb we still experience some issues. We used a
> rotary
> > > pallet and performed a DOE to determine the most optimum board
> > > orientation.
> > >  Just a suggestion.
> > >
> > >
> > >
> > > Carl Ray
> > > Sr. Manufacturing Engineer
> > > Huntsville, AL 35807
> > > Phone: 256-882-4800 ext. 8845
> > > Cell: 256-990-1990
> > > [log in to unmask]
> > >
> > > >>> [log in to unmask] 10/21/2003 9:00:55 AM >>>
> > > Richard,
> > >
> > > I have done this in a former life with good results on a variety
> of
> > > boards. And it can be done without a glue dispenser, however you
> > will
> > > then need two screen printers. You first print your paste using a
> 4
> > > mil
> > > stencil, then print your glue. The glue stencil will be 8-10 mil,
> > with
> > > underside cavities ~6 mil deep to allow clearance of the glue
> > stencil
> > > to
> > > the pasted pads. Due to the thickness of the glue stencil, you
> will
> > > require smaller than normal glue apertures. You also need a glue
> > that
> > > does not string to prevent paste contamination during glue stencil
> > > release. You can then run the board through a standard place and
> > > reflow
> > > process, the reflow preheat ramp cures the glue before reflow.
> > > Afterwards, a standard laminar wave will be fine for both your
> > through
> > > hole parts and bottom side discretes.
> > >
> > > Mike
> > >
> > > -----Original Message-----
> > > From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Lepa
> > > Sent: Monday, October 20, 2003 4:35 PM
> > > To: [log in to unmask]
> > > Subject: [TN] SMT Glue and Paste with Wavesolder
> > >
> > >
> > > Hello Technetters,
> > >
> > > We have a very challenging board that has quite a high quantity of
> > SMT
> > > parts on the bottom side, both Rs and Cs and SOICs.  The problem
> is
> > > that
> > > I cannot use the chipwave on the soldering machine because there
> are
> > > large open areas on the topside of the boards where the solder
> will
> > > flood through.  Since I can't use the chipwave I get a lot of
> solder
> > > skips in addition to bridging.
> > >
> > >
> > > The question is:  Has anyone ever used the glue/paste/place/reflow
> > > process and then used the wavesolder to re-solder the bottomside
> SMT
> > > parts and solder the thru-hole parts?  Are there any inherent
> > problems
> > > with using this process?  Would this process reduce reliability of
> > the
> > > parts due to increased stress levels and intermetallics.  Your
> help
> > > will
> > > be greatly appreciated.
> > >
> > > Thanks,
> > >
> > > Richard Lepa
> > > Manufacturing Engineer
> > >
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