You should develop your own follow up table. (beside the incoming
inspection statistical method of accept / reject table).

I recommend follow up table of common rejects families (mech. deviations,
warpage, solderability, drills diameter, finish plating / coating,
documents, solder mask, solder balls etc.) for each supplier per shipment
and per major or minor failure.

After a while you will see that each supplier has its typical failure that
should be analyzed and to be corrected.

Best  Regards

ROKAH Reuven


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                      bob wettermann
                      <[log in to unmask]         To:      [log in to unmask]
                      NET>                     cc:
                      Sent by: TechNet         Subject: [TN] Board Shop Outgoing QC Measurement
                      <[log in to unmask]         Suggestions
                      >


                      23/10/03 03:10
                      AM
                      Please respond
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                      Please respond
                      to bob
                      wettermann





What is the the most common practice for measuring the outgoing QC levels
of a PCB fabrication facility? Are ppm defect rates used? If so how are
they practically measured-by the number of solder joints, the number of
operations performed per board or...?

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