Ramon,
I have the seen several variations from 10 - 35 degrees. I also
noticed that it depends on the design of the board and technologies used
in most cases.
>>> "Dehoyos, Ramon" <[log in to unmask]> 10/21/2003 11:37:58 AM
>>>
Carl:
That is what I understood. My question was about the board or
boards
that you did your DOE on.
Regards,
Ramon
> -----Original Message-----
> From: Carlr Ray [SMTP:[log in to unmask]]
> Sent: Tuesday, October 21, 2003 12:23 PM
> To: [log in to unmask]; Dehoyos, Ramon
> Subject: Re: [TN] SMT Glue and Paste with Wave solder
>
> Ramon,
> The pallet I was referring to would be used to determine the
> rotational angle of the product as it is introduce to the wave
solder.
>
> >>> [log in to unmask] 10/21/2003 11:05:59 AM >>>
> Carl:
> Did you find this angle to be around 16 degrees? If
you
> can
> answer this question.
> Regards,
> Ramon
>
> > -----Original Message-----
> > From: Carlr Ray [SMTP:[log in to unmask]]
> > Sent: Tuesday, October 21, 2003 10:44 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] SMT Glue and Paste with Wave solder
> >
> > Richard,
> > As an option to try to optimize your wave process have you
> considered
> > using a rotary wave pallet? I have used the process of
> > glue/paste/place/reflow/wave and had good success but depending on
> the
> > design of the pcb we still experience some issues. We used a
rotary
> > pallet and performed a DOE to determine the most optimum board
> > orientation.
> > Just a suggestion.
> >
> >
> >
> > Carl Ray
> > Sr. Manufacturing Engineer
> > Huntsville, AL 35807
> > Phone: 256-882-4800 ext. 8845
> > Cell: 256-990-1990
> > [log in to unmask]
> >
> > >>> [log in to unmask] 10/21/2003 9:00:55 AM >>>
> > Richard,
> >
> > I have done this in a former life with good results on a variety
of
> > boards. And it can be done without a glue dispenser, however you
> will
> > then need two screen printers. You first print your paste using a
4
> > mil
> > stencil, then print your glue. The glue stencil will be 8-10 mil,
> with
> > underside cavities ~6 mil deep to allow clearance of the glue
> stencil
> > to
> > the pasted pads. Due to the thickness of the glue stencil, you
will
> > require smaller than normal glue apertures. You also need a glue
> that
> > does not string to prevent paste contamination during glue stencil
> > release. You can then run the board through a standard place and
> > reflow
> > process, the reflow preheat ramp cures the glue before reflow.
> > Afterwards, a standard laminar wave will be fine for both your
> through
> > hole parts and bottom side discretes.
> >
> > Mike
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Lepa
> > Sent: Monday, October 20, 2003 4:35 PM
> > To: [log in to unmask]
> > Subject: [TN] SMT Glue and Paste with Wavesolder
> >
> >
> > Hello Technetters,
> >
> > We have a very challenging board that has quite a high quantity of
> SMT
> > parts on the bottom side, both Rs and Cs and SOICs. The problem
is
> > that
> > I cannot use the chipwave on the soldering machine because there
are
> > large open areas on the topside of the boards where the solder
will
> > flood through. Since I can't use the chipwave I get a lot of
solder
> > skips in addition to bridging.
> >
> >
> > The question is: Has anyone ever used the glue/paste/place/reflow
> > process and then used the wavesolder to re-solder the bottomside
SMT
> > parts and solder the thru-hole parts? Are there any inherent
> problems
> > with using this process? Would this process reduce reliability of
> the
> > parts due to increased stress levels and intermetallics. Your
help
> > will
> > be greatly appreciated.
> >
> > Thanks,
> >
> > Richard Lepa
> > Manufacturing Engineer
> >
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