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October 2003

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Subject:
From:
Carlr Ray <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Oct 2003 11:23:07 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (183 lines)
Ramon,
 The pallet I was referring to would be used to determine the
rotational angle of the product as it is introduce to the wave solder.

>>> [log in to unmask] 10/21/2003 11:05:59 AM >>>
        Carl:
                Did you find this angle to be around 16 degrees? If you
can
answer this question.
                Regards,
                Ramon

> -----Original Message-----
> From: Carlr Ray [SMTP:[log in to unmask]]
> Sent: Tuesday, October 21, 2003 10:44 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] SMT Glue and Paste with Wave solder
>
> Richard,
>  As an option to try to optimize your wave process have you
considered
> using a rotary wave pallet? I have used the process of
> glue/paste/place/reflow/wave and had good success but depending on
the
> design of the pcb we still experience some issues. We used a rotary
> pallet and performed a DOE to determine the most optimum board
> orientation.
>  Just a suggestion.
>
>
>
> Carl Ray
> Sr. Manufacturing Engineer
> Huntsville, AL 35807
> Phone: 256-882-4800 ext. 8845
> Cell: 256-990-1990
> [log in to unmask]
>
> >>> [log in to unmask] 10/21/2003 9:00:55 AM >>>
> Richard,
>
> I have done this in a former life with good results on a variety of
> boards. And it can be done without a glue dispenser, however you
will
> then need two screen printers. You first print your paste using a 4
> mil
> stencil, then print your glue. The glue stencil will be 8-10 mil,
with
> underside cavities ~6 mil deep to allow clearance of the glue
stencil
> to
> the pasted pads. Due to the thickness of the glue stencil, you will
> require smaller than normal glue apertures. You also need a glue
that
> does not string to prevent paste contamination during glue stencil
> release. You can then run the board through a standard place and
> reflow
> process, the reflow preheat ramp cures the glue before reflow.
> Afterwards, a standard laminar wave will be fine for both your
through
> hole parts and bottom side discretes.
>
> Mike
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Lepa
> Sent: Monday, October 20, 2003 4:35 PM
> To: [log in to unmask]
> Subject: [TN] SMT Glue and Paste with Wavesolder
>
>
> Hello Technetters,
>
> We have a very challenging board that has quite a high quantity of
SMT
> parts on the bottom side, both Rs and Cs and SOICs.  The problem is
> that
> I cannot use the chipwave on the soldering machine because there are
> large open areas on the topside of the boards where the solder will
> flood through.  Since I can't use the chipwave I get a lot of solder
> skips in addition to bridging.
>
>
> The question is:  Has anyone ever used the glue/paste/place/reflow
> process and then used the wavesolder to re-solder the bottomside SMT
> parts and solder the thru-hole parts?  Are there any inherent
problems
> with using this process?  Would this process reduce reliability of
the
> parts due to increased stress levels and intermetallics.  Your help
> will
> be greatly appreciated.
>
> Thanks,
>
> Richard Lepa
> Manufacturing Engineer
>
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