Why not simply glue/paste/place and solder the components during the wave
solder process?

We do expose the components to a wave after reflow, some times (rarely), but
it all depends on the type of components you have on the bottom side.

Regards,
Lakshmi



-----Original Message-----
From: Richard Lepa [mailto:[log in to unmask]]
Sent: Monday, October 20, 2003 5:35 PM
To: [log in to unmask]
Subject: [TN] SMT Glue and Paste with Wavesolder


Hello Technetters,

We have a very challenging board that has quite a high quantity of SMT parts
on the bottom side, both Rs and Cs and SOICs.  The problem is that I cannot
use the chipwave on the soldering machine because there are large open areas
on the topside of the boards where the solder will flood through.  Since I
can't use the chipwave I get a lot of solder skips in addition to bridging.


The question is:  Has anyone ever used the glue/paste/place/reflow process
and then used the wavesolder to re-solder the bottomside SMT parts and
solder the thru-hole parts?  Are there any inherent problems with using this
process?  Would this process reduce reliability of the parts due to
increased stress levels and intermetallics.  Your help will be greatly
appreciated.

Thanks,

Richard Lepa
Manufacturing Engineer

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