Hi Jim,
>Are there any sort of industry standards which define the following tests:
>    a. three point bend test
No
>    b. four point bend test
Not yet, 6-10d is working on it together with JEDEC. There likely will be
separate TMs for "Monotonic Bending" [purpose is to find 'brittle' interfacial
solder joint failures resulting from low interfacial/metallization strength] and
"Dynamic Bending" [similar to the IEEE CLTF test for the purpose to fatigue
SJs similar to T-cycling--it works to  some degree]
>    c. ball shear test
No, there should not be one, because the strength values are meaningless,
only the failure mode is telling.
>    d. board level torsion test
No, see (c)

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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