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October 2003

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Subject:
Re: Warpage after PLSM
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Oct 2003 09:01:35 +0300
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text/plain
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You may have internal stresses inside the layers because of poor design or
press thermal cooling cycle or the peelable is too thick that expand /
shrink during the thermal curing.

Best  Regards

ROKAH Reuven




                      "S.R.
                      Madhuchandra"              To:      [log in to unmask]
                      <s.r.madhuchandra@         cc:
                      IN.ATS.NET>                Subject: [TN] Warpage after PLSM
                      Sent by: TechNet
                      <[log in to unmask]>


                      20/10/2003 09:12
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to "S.R.
                      Madhuchandra"





fellow technetters

In some of the part numbers, we are facing a strange phenomenon

The boards will be flat till the process of PLSM(peelable solder mask)
but after the PLSM, there will be severe warpage & wobbling

In PLSM, we are doing both UV & thermal curing

Can some one throw some light on this

Thanks in advance
Madhu


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