CALL FOR PARTICIPATION
"FLEX and CHIPS"
IPC 2nd International Conference on Flexible Circuits,
Chip Scale and Bare Die Packaging
Educational Courses: January 6, 2004
Technical Conference and Tabletop Exhibits: January 7-8, 2004
Fiesta Inn ? Tempe, AZ
Flexible circuitry, chip scale packaging (CSP) and bare die packaging - a mix of seemingly unrelated topics, in fact are the missing pieces to the interconnection puzzle. All three are equally important in their effect on electronics manufacturing in this competitive marketplace.
The blending of these technologies is well underway, with new designs, materials and applications appearing on a regular basis. Don't miss this opportunity to find out everything you need to know about flexible circuits, chip scale and bare die packaging.
While this international conference is highlighting the combination of flexible circuits, chip scale and bare die technologies, it is also recognized that the topics have critical and independent properties. Current developments with these areas will also address within this conference.
Potential topics for presentations at the Flex and Chips Conference are:
CSP Standards Progress
Wafer Level CSP
CSP Design
CSP Die Attach
CSP Solder Joint Reliability
Flex Processing Innovations
Flex Assembly
Flex Market Trends
Non-CSP Flex Applications
Flex Test and Reliability
Flex HDI for CSP Applications
CSPs in Three Dimension
Flex and CSP Materials
Design for CSPs on Flex
Flex with CSP Yields
Flip Chip Development
Flex and Lead Free
Advanced Packaging
The International Conference on Flexible Circuits, Chip Scale and Bare Die Packaging offers presentation time slots between 30-45 minutes. The presentation must be of a non-commercial nature, focusing on the technology rather than serving as an advertisement for a company's product. The deadline for submission of your abstract is November 26, 2003.
For consideration of inclusion of your idea for a paper and/or presentation, you must submit a 200-300 word abstract plus a brief biography to [log in to unmask] The deadline for receipt of your presentation to IPC is no later than December 19, 2003.
For information on a tabletop exhibit or sponsorship opportunities, please contact Alexandra Curtis at 847-790-5377 or e-mail at [log in to unmask]
Alexandra Curtis
Continuing Education Manager
IPC
2215 Sanders Road, Ste 250
Northbrook, IL 60062
Phone: 847-790-5377
Fax: 847-504-2377
[log in to unmask]
www.ipc.org
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