Sorry for the late response - just returned from a vacation and trying to
find myself between over a hundred mails.
However, there is a group in IPC working on definition of a calculation and
declaration methods of hazardous materials contained in electronic products.
The group leader is [log in to unmask]
> > ----- Original Message -----
> > From: "Mike Fenner" <[log in to unmask]>
> > To: <[log in to unmask]>
> > Sent: Tuesday, October 14, 2003 12:01 PM
> > Subject: Re: [TN] How to estimate the amount of lead in a
> PCB-Assembly ?
> >
> >
> > > I think the problem is that knowing how much Pb is where
> doesn't really
> > > give a route map to its elimination, so nobody has
> thought in this way.
> > > The usual suggested route, in outline, is:
> > >
> > > 1) Change board finish to eliminate Pb (example: from
> HASL to Ag or OSP
> > > etc)
> > > 2) Wait for component people to bring out lead free and lead free
> > > (temperature) rated devices
> > > 3) Change the paste/solder.
> > >
> > > In parallel/off line
> > > 4) Audit component suppliers for Pb-free availability
> dates types etc.
> > > 5) Pb-free paste/solder can be used now to evaluate approve types,
> > > explore production parameters, gain experience, verify
> reliability and
> > > so on.
> > >
> > > This way ensures compatibility and gives a "change one
> thing at a time"
> > > path. 1) and 2) are to your specification, but most people have no
> > > control over 2, and availability of components is the
> real decider on
> > > switching.
> > >
> > > Regards
> > >
> > > Mike Fenner
> > >
> > > Indium Corporation
> > > T: + 44 1908 580 400
> > > M: + 44 7810 526 317
> > > F: + 44 1908 580 411
> > > E: [log in to unmask]
> > > W: www.indium.com
> > > Pb-free: www.Pb-Free.com
> > >
> > >
> > >
> > > -----Original Message-----
> > > From: TechNet [mailto:[log in to unmask]] On Behalf Of d. terstegge
> > > Sent: Monday, October 13, 2003 10:31 AM
> > > To: [log in to unmask]
> > > Subject: [TN] How to estimate the amount of lead in a
> PCB-Assembly ?
> > >
> > >
> > > Hi Technet,
> > >
> > > I posted this same message to the LeadFree forum last
> week, but didn't
> > > receive any usefull answers (except a mentioning of the
> availabliity of
> > > Pulverization & Analytical Techniques), so I try again here :
> > >
> > > I just received a question from one of our customers,
> asking how much
> > > lead their products contain. The answer will help them to
> make decisions
> > > about changes to their (future) boarddesigns. This seems
> not so easy to
> > > answer, as lead is introduced in the product as HASL, as
> solderpaste, as
> > > wave soldered joints and as finishing of component
> terminations. I don't
> > > want to reinvent the wheel, therefore I'm looking for
> recommendations on
> > > a practical approach to deal with this question, that I'm
> sure many of
> > > you have had before. All input is appreciated.
> > >
> > > Daan Terstegge
> > > Thales Communications
> > > Unclassified mail
> > > Personal Website: http://www.smtinfo.net
> > >
> > >
> >
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