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October 2003

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Subject:
From:
Collins Graham <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Oct 2003 08:58:09 -0400
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Hi Edwin
General assembly: FR-4 boards - we do not bake.
General assembly: Polyimide boards - we do bake before wave soldering,
so as to avoid delamination in wave soldering operation.

Before rework/repair - we bake very thick boards to pre-heat them if we
have to rework through-hole connections (very rare).

We also have to bake to remove moisture if the rework is to a moisture
sensitive IC (or a near neighbor), if the rework procedure will heat the
component body.  So bake the board if the IC is to be removed, but not
for a solder joint touch-up...



regards,

Graham Collins
Process Engineer,
Northrop Grumman Canada Corporation
Halifax
(902) 873-2000 ext 6215

>>> [log in to unmask] 10/16/03 09:50AM >>>
iT HAS BENN OUR PRACTICE IN THE PAST TO BAKE OUT PWAS BEFORE SOLDERING
AT
EITHER 185 DEGREES f 0R 185 DEGREES F DEPENDING
ON WHETHER THE ASSEMBLIES OR BOARDS HAD BEEN PREVIOUSLY BAKED OR NOT.
tODAY
WE ARE DOING SMT AND SELEWCTIVE SOLDERING.
MY QUESTION IS," WHAT DO OTHER PEOPLE DO ABOUT BAKING BARE BOARDS,
ASSEMBLIES ON INITIAL SOLDERING AND BEFORE REPAIR?
aLSO, WHY DO YOU BAKE OR NOT BAKE?

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