TECHNET Archives

October 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Edwin Louis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Oct 2003 08:50:24 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
iT HAS BENN OUR PRACTICE IN THE PAST TO BAKE OUT PWAS BEFORE SOLDERING AT
EITHER 185 DEGREES f 0R 185 DEGREES F DEPENDING
ON WHETHER THE ASSEMBLIES OR BOARDS HAD BEEN PREVIOUSLY BAKED OR NOT. tODAY
WE ARE DOING SMT AND SELEWCTIVE SOLDERING.
MY QUESTION IS," WHAT DO OTHER PEOPLE DO ABOUT BAKING BARE BOARDS,
ASSEMBLIES ON INITIAL SOLDERING AND BEFORE REPAIR?
aLSO, WHY DO YOU BAKE OR NOT BAKE?

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2