Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 15 Oct 2003 19:17:44 +0300 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Semantic reproach: it is not the BGA that has scales: 'solder ball
scales' may have been more explicit :-)
Brian
Dave Chapman wrote:
> Scaling - Irregular patterns on the solder joint surface, particularly of a
> BGA ball, uniform in nature and resembling scales or flakes.
>
>
> Causes:
>
> a: As a solder sphere moves from solid to
> liquid, a volumetric change takes place uniformly across the surface of the
> ball. The solder spheres received enough heat to begin to reflow, but the
> heating process stopped, leaving the solder in its thixotropic or 'pasty'
> phase on the tin/lead phase diagram. This solder did not reach the melt
> point for the proper length of time resulting in lead weeping to the surface
> in the form of lead flakes that are fully connected. Visible scaling can
> indicate that insufficient heat was given to the joint in order to reach
> complete reflow and to allow for enough activation energy to produce a
> proper intermetallic bond. A lack of the intermetallic bond will lead to
> premature joint failure.
>
>
>
> b: Cooling process too slow after the peak
> reflow temperature was reached. This will lead to intermetallic growth and
> tin/lead separation or a heavy concentration which shows up as a coarse
> grain structure often resembling scales or flakes on the surface of a BGA
> joint.
>
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Wednesday, October 15, 2003 9:48 AM
> To: [log in to unmask]; [log in to unmask]
> Cc: [log in to unmask]
> Subject: Re: [TN] BGA Scaling
>
>
>
> Hi Dave! Can you further define "BGA Scaling"? Its a term I am not familiar
> with.
>
> Dave
>
>
>
>
> Dave Chapman
>
> <dchapman@CIRCUITS To: [log in to unmask]
>
> ERVICE.COM> cc:
>
> Sent by: TechNet Subject: Re: [TN] BGA
> Scaling
> <[log in to unmask]>
>
>
>
>
>
> 10/14/2003 08:43
>
> AM
>
> Please respond to
>
> "TechNet E-Mail
>
> Forum."; Please
>
> respond to Dave
>
> Chapman
>
>
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Dave Chapman
> To: [log in to unmask]
> Subject: Re: [TN] BGA Scaling
>
> I am interested to find information on BGA scaling effect and
> solution, we saw this phenomena yesterday with a ERSA Scope
> demonstration. I have searched archives here and at SMTNET but no
> good information.
> Dave Chapman
> Circuit Service
> ---------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV
> 1.8e
> To unsubscribe, send a message to [log in to unmask] with following
> text in the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
> ---------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|