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October 2003

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Oct 2003 05:27:00 -0700
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        Same here. It is good to know that some of us midgets walk among
giants ( figure of speech).  We are fortunate to have someone of that statue
to comment on specially difficult subjects to give this forum a good
direction.
        Congratulations
        Ramon

> -----Original Message-----
> From: Steve Gregory [SMTP:[log in to unmask]]
> Sent: Tuesday, October 14, 2003 9:55 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] Congratulations Werner!
> 
> I second that!!! 
>  
> I would also like to express my thanks to Werner for being an active
> participant to our humble forum...his contributions are priceless.
>  
> Not to mention that we all get them for free!
>  
> Thanks again Werner!!!
>  
> -Steve Gregory-
> 
>       For those who might have missed it 
> 	
>       "Mr. Reliability" Awarded IPC's 2003 Hall of Fame Award
> 	
>       NORTHBROOK, Ill., October 7, 2003--IPC-Association Connecting
> Electronics Industries® recently honored Werner Engelmaier, Engelmaier
> Associates, L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame
> Award at the 2003 IPC Annual Meeting in Minneapolis, Minn.
>       Based on exceptional lifetime achievement, the Raymond E. Pritchard
> IPC Hall of Fame Award is IPC's highest level of recognition, honoring
> members who make extraordinary contributions to IPC and the electronic
> interconnection industry.
>       Known as "Mr. Reliability" in the industry for his vast experience
> in product reliability, Werner Engelmaier was selected as this year's
> recipient for his dedicated service and outstanding industry contributions
> over the past three decades.
>       A founder and current chairman of the IPC Product Reliability
> Committee, Engelmaier also currently chairs the IPC Accelerated
> Reliability Testing Subcommittee and serves as vice-chair of both the IPC
> Plated-Through Hole/Via Reliability and the IPC Plated-Through Hole/Via
> Post Separation Task Groups.
>       A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier
> has been an active member of IPC technical committees on flex circuits,
> molded printed boards, surface mount land patterns, soldering, test
> methods, and the Technical Activities Executive Committee.
>       Over the years, he has substantially contributed to more than 20 IPC
> standards and documents and has represented the reliability point of view
> in many others. Engelmaier has published over 145 technical papers and
> columns and contributes to IPC's TechNet and Lead Free Forums.
>       Apart from his service to IPC, Engelmaier has served on an IEEE task
> force; become a director of the International Electronics Packaging
> Society; chaired two subcommittees and a testing committee for the
> American Society of Testing Material; and become a life member of the
> American Society of Mechanical Engineers, the International
> Microelectronics and Packaging Society. He also was issued two patents and
> became a Distinguished Member of the Technical Staff while employed at
> Bell Labs.
> 
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