Congratulations Werner
Best Regards
ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
ISRAEL
Tel: 972-3-9266734 Mobile:972-55-786734
Fax: 972-3-9266480
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cc:
Subject: Re: [TN] Congratulations Werner!
From: Joe Fjelstad
To: [log in to unmask]
Sent: Tuesday, October 14, 2003 8:42 PM
Subject: [TN] Congratulations Werner!
For those who might have missed it
"Mr. Reliability" Awarded IPC's 2003 Hall of Fame Award
NORTHBROOK, Ill., October 7, 2003--IPC?Association Connecting Electronics
Industries® recently honored Werner Engelmaier, Engelmaier Associates,
L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame Award at the
2003 IPC Annual Meeting in Minneapolis, Minn.
Based on exceptional lifetime achievement, the Raymond E. Pritchard IPC
Hall of Fame Award is IPC's highest level of recognition, honoring members
who make extraordinary contributions to IPC and the electronic
interconnection industry.
Known as "Mr. Reliability" in the industry for his vast experience in
product reliability, Werner Engelmaier was selected as this year's
recipient for his dedicated service and outstanding industry contributions
over the past three decades.
A founder and current chairman of the IPC Product Reliability Committee,
Engelmaier also currently chairs the IPC Accelerated Reliability Testing
Subcommittee and serves as vice-chair of both the IPC Plated-Through
Hole/Via Reliability and the IPC Plated-Through Hole/Via Post Separation
Task Groups.
A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier has
been an active member of IPC technical committees on flex circuits, molded
printed boards, surface mount land patterns, soldering, test methods, and
the Technical Activities Executive Committee.
Over the years, he has substantially contributed to more than 20 IPC
standards and documents and has represented the reliability point of view
in many others. Engelmaier has published over 145 technical papers and
columns and contributes to IPC's TechNet and Lead Free Forums.
Apart from his service to IPC, Engelmaier has served on an IEEE task
force; become a director of the International Electronics Packaging
Society; chaired two subcommittees and a testing committee for the
American Society of Testing Material; and become a life member of the
American Society of Mechanical Engineers, the International
Microelectronics and Packaging Society. He also was issued two patents and
became a Distinguished Member of the Technical Staff while employed at
Bell Labs.
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847-509-9700 ext.5315
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