Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 13 Oct 2003 10:47:48 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi to all,
From an IC device reliability point of view, does anyone know whether it is
possible to store say J-STD-020B class-3 devices in a storage oven at a
possibly
60 Deg-C for an un-limited (within reason) period to save re-sealing
(shrink-wrapping)
the trays/devices.
I guess this is similar to using a storage-cabinet but would eliminate the
requirement to actually re-seal the bags.
Any thoughts ??
> Thanks,
> Douglas I McCall
> Printed Circuit Board Assembly Engineer,
>
> /// /// /// BOC EDWARDS
H BOC Edwards, 15 Marshall Road, Eastbourne, East Sussex, England, BN22
9BA
> * +44 (0)1323 501147
* +44(0)1323 509824
*+44 (0)7785 247 685
> * mailto:[log in to unmask]
>
>
_____________________________________________________________________
This e-mail has been scanned for viruses by MCI's Internet Managed Scanning Services - powered by MessageLabs. For further information visit http://www.mci.com
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|