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October 2003

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Oct 2003 15:50:04 -0400
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Kaye Clayo,

We built some hardware a few years ago with SnAgCu, which wetted better
than their No Clean counterparts. Found out that the SnAgCu solder paste
was a water soluble being marketed as a No-Clean. It had large amount of
bromides when compared to the other solder pastes we worked on, which
lead us to believe that is why that specific vendor's solder paste
wetted better than other vendors.

Recommend using Nitrogen in your reflow ovens to improve wetting.

Give me a call off line for the details.

Hope this helps.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x208
Fax: (610) 362-1290


This message is for informational purposes only and does not supersede,
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kaye Clayo
Sent: Friday, October 10, 2003 3:11 PM
To: [log in to unmask]
Subject: [TN] Water Soluble Lead-Free Solderpaste


Hi Technet,

I am fielding this question to you, this is not my area of experience.
(A disclaimer just in case I goof something up in the translation)

Has anyone out there worked with water soluble lead free solderpaste
with silver content? We would be interested in learning any issues with
solderability or wetting, or if anyone has had any success with this
type of paste.

Thank you,

Kaye Clayo
Sr. P. C. Layout Designer
Keithley Instruments, Inc.
Solon, OH

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