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October 2003

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Oct 2003 13:33:11 -0400
Content-Type:
text/plain
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text/plain (60 lines)
Yeah, I think you're right. Usually the component manufacturer offers a
version of the component with a nickel barrier over the noble metal
which is applied directly to the ceramic. But it the package can't take
high temperature, why bother.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Crepeau, Phil
> Sent: Thursday, October 09, 2003 12:56 PM
> To: [log in to unmask]
> Subject: Re: [TN] Flip Chip Diode 0205
>
>
> hi,
>
> i think the issue here is one of using a diode that has a
> terminal finish that is best suited to hybrid wire bonding,
> conductive adhesive attach, etc.
>
> tin lead solders wash off the gold which is all there is on
> these parts.  last i heard, soldering to ceramic is pretty difficult.
>
> phil
>
> -----Original Message-----
> From: Dave Chapman [mailto:[log in to unmask]]
> Sent: Thursday, October 09, 2003 8:47 AM
> To: [log in to unmask]
> Subject: Re: [TN] Flip Chip Diode 0205
>
>
> Spec on component says use solder which does not scavenge
> gold such as Indalloy #2, or conductive epoxy or low temp
> solder preform. Also says cannot withstand 200 C for more
> than 10 seconds. Dave C.
>
> -----Original Message-----
> From: Werner Engelmaier [mailto:[log in to unmask]]
> Sent: Thursday, October 09, 2003 10:27 AM
> To: [log in to unmask]
> Subject: Re: [TN] Flip Chip Diode 0205
>
>
> Hi Dave,
> You are not clear as to what "cannot go through Sn-Pb due to
> embrittlement" means. Preforms, as well as Sipad are also
> Sn-Pb. I have no experience with conductive epoxies, but know
> that they are not as good as solder from a reliability perspective.
>
> Werner Engelmaier

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