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October 2003

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Subject:
From:
Dave Chapman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Oct 2003 10:47:00 -0500
Content-Type:
text/plain
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text/plain (44 lines)
Spec on component says use solder which does not scavenge gold such as
Indalloy #2, or conductive epoxy or low temp solder preform.
Also says cannot withstand 200 C for more than 10 seconds.
Dave C.

-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Thursday, October 09, 2003 10:27 AM
To: [log in to unmask]
Subject: Re: [TN] Flip Chip Diode 0205


Hi Dave,
You are not clear as to what "cannot go through Sn-Pb due to embrittlement"
means. Preforms, as well as Sipad are also Sn-Pb.
I have no experience with conductive epoxies, but know that they are not as
good as solder from a reliability perspective.

Werner Engelmaier

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