So the draft version of IPC-7095 mentions that solder joint
embrittlement is indeed an issue with ENIG. I'm a bit surprised, since I
saw many messages on TechNet stating that even Black Pad problems (which
was known as THE reliability problem with ENIG boards) have become a
thing of the past, at least for the better board manufacturers.
The only document that I found that has detailed relevant information
about solder joint embrittlement on ENIG is from Hewlett-Packard, and
dates back from 1998. I believe this cannot be the "preliminary
analyses" that IPC refers to.
I would be very interested in the data/reports that IPC used to come to
their conclusions. Any idea where I can find this ?
Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
>>> [log in to unmask] 10/09/03 02:23pm >>>
Thanks All,
I didn't realize there was a new draft available. I will get it.
Jim Kittel
-----Original Message-----
From: Tegehall Per-Erik [mailto:[log in to unmask]]
Sent: Thursday, October 09, 2003 12:44 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG solder joint embrittlement
Jim,
It is in the draft version of Revision A of IPC-7095, that is, it is
not yet
released. If you is a member of IPC, you can download it from IPC's
webpage.
Per-Erik
-----Ursprungligt meddelande-----
Från: [log in to unmask] [mailto:[log in to unmask]]
Skickat: den 8 oktober 2003 22:02
Till: [log in to unmask]; Tegehall Per-Erik
Ämne: RE: [TN] ENIG solder joint embrittlement
I don't see that reference in the released issue of IPC-7095. Was it
remove
prior to release or did I miss it?
Thanks
Jim Kittel
-----Original Message-----
From: Tegehall Per-Erik [mailto:[log in to unmask]]
Sent: Tuesday, October 07, 2003 1:02 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG solder joint embrittlement
Eddie,
As David already has pointed out, it is soldering to a nickel surface
that
is the issue, the gold layer is too thin to cause gold embrittlement.
Below
are two quotations from a draft of IPC-7095A, "Design and Assembly
Process
Implementation for BGAs", supporting that solder joint embrittlement
is
indeed an issue when ENIG is used.
"Recent preliminary analysis indicates that the BGA brittle solder
joint
fracture happens under a high level of both applied strain and strain
rate
even if hyperactive corrosion (i.e. "black pad") does not take place".
"Based on industry experience over the past several years, it appears
that
BGAs and nickel surface coatings may not be an ideal combination. If
nickel
surface coatings are used with BGAs it is recommended that the BGA
surface
area not exceed 25 mm2."
Per-Erik Tegehall
IVF
Sweden
-----Ursprungligt meddelande-----
Från: Eddie Rocha [mailto:[log in to unmask]]
Skickat: den 6 oktober 2003 23:51
Till: [log in to unmask]
Ämne: [TN] ENIG solder joint embrittlement
Does anybody have data or literature which shows that solder joint
embrittlement is not an issue when ENIG is used? I have a customer
that needs this supporting data before he can allow us to use ENIG. Is
this embrittlement issue related only to a certain thickness of gold?
I'd appreciate any feedback on this topic.
thanks,
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
8
47-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
