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Subject:	Re: ENIG solder joint embrittlement
From:	Dave Chapman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 9 Oct 2003 09:14:14 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

Hi Werner and all, we are looking at a new package Flip Chip Diode 0205 size
.007 thick which cannot go through Sn-Pb due to embrittlement. MFG
recommends attach with conductive epoxy or solder preform.

Questions:
Is SIPAD considered solder preform?

How could epoxy be applied that small volume?

Dave Chapman


-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, October 08, 2003 5:39 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG solder joint embrittlement


Hi Jim,
Look on p.31 & p.32, section 5.3.3, in the July 2003 draft.

Regards,
Werner Engelmaier

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