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October 2003

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Subject:
From:
Jim Kittel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Oct 2003 14:01:58 -0600
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I don't see that reference in the released issue of IPC-7095.  Was it remove
prior to release or did I miss it?
Thanks
Jim Kittel

-----Original Message-----
From: Tegehall Per-Erik [mailto:[log in to unmask]]
Sent: Tuesday, October 07, 2003 1:02 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG solder joint embrittlement


Eddie,

As David already has pointed out, it is soldering to a nickel surface that
is the issue, the gold layer is too thin to cause gold embrittlement. Below
are two quotations from a draft of IPC-7095A, "Design and Assembly Process
Implementation for BGAs", supporting that solder joint embrittlement is
indeed an issue when ENIG is used.

"Recent preliminary analysis indicates that the BGA brittle solder joint
fracture happens under a high level of both applied strain and strain rate
even if hyperactive corrosion (i.e. "black pad") does not take place".

"Based on industry experience over the past several years, it appears that
BGAs and nickel surface coatings may not be an ideal combination. If nickel
surface coatings are used with BGAs it is recommended that the BGA surface
area not exceed 25 mm2."

Per-Erik Tegehall
IVF
Sweden

-----Ursprungligt meddelande-----
Från: Eddie Rocha [mailto:[log in to unmask]]
Skickat: den 6 oktober 2003 23:51
Till: [log in to unmask]
Ämne: [TN] ENIG solder joint embrittlement


Does anybody have data or literature which shows that solder joint
embrittlement is not an issue when ENIG is used? I have a customer
that needs this supporting data before he can allow us to use ENIG. Is
this embrittlement issue related only to a certain thickness of gold?
I'd appreciate any feedback on this topic.
thanks,

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