I agree. In addition on same assumption of reasonable workmanship, in
either size in a pull to destruction test, the failure mode is not
likely to be in the lead solder interface, [solder joint is likely to be
stronger than hole to board adhesion etc.] so its some what of a mute
point anyway.
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
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Pb-free: www.Pb-Free.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Friday, October 24, 2003 4:49 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Strength
The larger ring might be a little stronger, but most of the strength of
the area of the connection would be in the PTH. The area increase on the
ring would be quite small. I don't think soldering technique has much
effect, assuming good process results.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Thursday, October 23, 2003 5:57 PM
To: [log in to unmask]
Subject: [TN] Solder Joint Strength
I had a question from a customer today which I could not answer.
Question was " if a pin is soldered in a through hole with an annular
ring of .010 is this a stronger joint than if the annular ring was .005"
. Doesn't this depend more on the soldering technique that the size of
the ring? Thanks. Steve Kelly
PFC Flexible Circuits Limited
Ph: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433
E-Mail: [log in to unmask]
---
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