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October 2003

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Subject:
From:
Ted Kong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Oct 2003 13:53:52 -0700
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text/plain (85 lines)
Hi Pankaj,

I don't have a ZEVAC 24 DRS, but I have seen bridging
due to moisture in the chip.  Have you tried baking
the parts before installing it?

Ted


--- "Karnwal, Pankaj" <[log in to unmask]>
wrote:
> Hello TechNet
>
> Anybody is using BGA rework station ' ZEVAC 24 DRS '
> we are facing problem
> in bga soldering it got shorting several times. what
> will the ideal profile
> any body suggest.
>
> we have 352 balls PBGA.
>
> Pankaj karnwal
> Jr. Engineer QA
> BARCO   INDIA
>
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