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Subject:	Re: ENIG solder joint embrittlement
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 9 Oct 2003 11:26:39 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

Hi Daan,
Given my consulting activities, I would not agree with the statement that
"Black Pad problems  have become a thing of the past, at least for the better
board manufacturers."
I certainy have no problem with the statements in IPC-7095A.
Many companies have given up on ENIG.

Werner Engelmaier

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