You may have internal stresses inside the layers because of poor design or
press thermal cooling cycle or the peelable is too thick that expand /
shrink during the thermal curing.
Best Regards
ROKAH Reuven
"S.R.
Madhuchandra" To: [log in to unmask]
<s.r.madhuchandra@ cc:
IN.ATS.NET> Subject: [TN] Warpage after PLSM
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20/10/2003 09:12
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Madhuchandra"
fellow technetters
In some of the part numbers, we are facing a strange phenomenon
The boards will be flat till the process of PLSM(peelable solder mask)
but after the PLSM, there will be severe warpage & wobbling
In PLSM, we are doing both UV & thermal curing
Can some one throw some light on this
Thanks in advance
Madhu
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