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October 2003

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From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Oct 2003 15:12:42 +0200
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 Didn't know you are so BIG, Werner! What costume number do you need? Ditto bravo! 
/Ingemar Hernefjord
Ericsson Microwave Systems                                                                                                                                       



 From: Joe Fjelstad
 To: [log in to unmask]
 Sent: Tuesday, October 14, 2003 8:42 PM
 Subject: [TN] Congratulations Werner!

 For those who might have missed it

 "Mr. Reliability" Awarded IPC's 2003 Hall of Fame Award

 NORTHBROOK, Ill., October 7, 2003--IPC?Association Connecting Electronics
 Industries® recently honored Werner Engelmaier, Engelmaier Associates,
 L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame Award at the
 2003 IPC Annual Meeting in Minneapolis, Minn.
 Based on exceptional lifetime achievement, the Raymond E. Pritchard IPC
 Hall of Fame Award is IPC's highest level of recognition, honoring members
 who make extraordinary contributions to IPC and the electronic
 interconnection industry.
 Known as "Mr. Reliability" in the industry for his vast experience in
 product reliability, Werner Engelmaier was selected as this year's
 recipient for his dedicated service and outstanding industry contributions
 over the past three decades.
 A founder and current chairman of the IPC Product Reliability Committee,
 Engelmaier also currently chairs the IPC Accelerated Reliability Testing
 Subcommittee and serves as vice-chair of both the IPC Plated-Through
 Hole/Via Reliability and the IPC Plated-Through Hole/Via Post Separation
 Task Groups.
 A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier has
 been an active member of IPC technical committees on flex circuits, molded
 printed boards, surface mount land patterns, soldering, test methods, and
 the Technical Activities Executive Committee.
 Over the years, he has substantially contributed to more than 20 IPC
 standards and documents and has represented the reliability point of view
 in many others. Engelmaier has published over 145 technical papers and
 columns and contributes to IPC's TechNet and Lead Free Forums.
 Apart from his service to IPC, Engelmaier has served on an IEEE task
 force; become a director of the International Electronics Packaging
 Society; chaired two subcommittees and a testing committee for the
 American Society of Testing Material; and become a life member of the
 American Society of Mechanical Engineers, the International
 Microelectronics and Packaging Society. He also was issued two patents and
 became a Distinguished Member of the Technical Staff while employed at
 Bell Labs.



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847-509-9700 ext.5315
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