Congratulations seems hardly to convey the impressive accomplishments
and service to the industry. Ditto
>>> [log in to unmask] 10/15/03 07:55AM >>>
Congratulations Werner
----- Original Message -----
From: Joe Fjelstad
To: [log in to unmask]
Sent: Tuesday, October 14, 2003 8:42 PM
Subject: [TN] Congratulations Werner!
For those who might have missed it
"Mr. Reliability" Awarded IPC's 2003 Hall of Fame Award
NORTHBROOK, Ill., October 7, 2003--IPC*Association Connecting
Electronics Industries® recently honored Werner Engelmaier, Engelmaier
Associates, L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame
Award at the 2003 IPC Annual Meeting in Minneapolis, Minn.
Based on exceptional lifetime achievement, the Raymond E. Pritchard
IPC Hall of Fame Award is IPC's highest level of recognition, honoring
members who make extraordinary contributions to IPC and the electronic
interconnection industry.
Known as "Mr. Reliability" in the industry for his vast
experience in product reliability, Werner Engelmaier was selected as
this year's recipient for his dedicated service and outstanding
industry contributions over the past three decades.
A founder and current chairman of the IPC Product Reliability
Committee, Engelmaier also currently chairs the IPC Accelerated
Reliability Testing Subcommittee and serves as vice-chair of both the
IPC Plated-Through Hole/Via Reliability and the IPC Plated-Through
Hole/Via Post Separation Task Groups.
A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier
has been an active member of IPC technical committees on flex circuits,
molded printed boards, surface mount land patterns, soldering, test
methods, and the Technical Activities Executive Committee.
Over the years, he has substantially contributed to more than 20 IPC
standards and documents and has represented the reliability point of
view in many others. Engelmaier has published over 145 technical papers
and columns and contributes to IPC's TechNet and Lead Free Forums.
Apart from his service to IPC, Engelmaier has served on an IEEE task
force; become a director of the International Electronics Packaging
Society; chaired two subcommittees and a testing committee for the
American Society of Testing Material; and become a life member of the
American Society of Mechanical Engineers, the International
Microelectronics and Packaging Society. He also was issued two patents
and became a Distinguished Member of the Technical Staff while employed
at Bell Labs.
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