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Tue, 14 Oct 2003 08:12:16 +0300 |
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Use vacuum oven for BGAs and other sensitive components or for fast drying
and circular oven for slow drying.
Each package should have specific temp. (tape / reel low temp and trays
high temp) bare PCBs should be dried also after long storage.
Best Regards
ROKAH Reuven
"Stolar, Paul W"
<Paul.Stolar@BAKER To: [log in to unmask]
HUGHES.COM> cc:
Sent by: TechNet Subject: Re: [TN] Baking Printed Wiring Boards and Assemblies
<[log in to unmask]>
14/10/2003 00:08
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
"Stolar, Paul W"
We bake everything prior to any soldering.
Paul Stolar
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Monday, October 13, 2003 3:52 PM
To: [log in to unmask]
Subject: Re: [TN] Baking Printed Wiring Boards and Assemblies
We use a lab oven and follow the guidelines in HDBK-001.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
> Sent: Monday, October 13, 2003 4:33 PM
> To: [log in to unmask]
> Subject: [TN] Baking Printed Wiring Boards and Assemblies
>
>
> I would like to know how people out there are baking SMT
> boards and assemblies for (1) convection reflow soldering,
> (2) Selective soldering
> and(3) component removal and repair.
>
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