Hi Brian,
I don't have references, but what has been brought up in this forum is
the use of square solder paste stencil aperatures to allow X-ray
inspection/verification of solder reflow.
As far as Phoenix x-ray idea, it is a good idea, but only if your flux
is aggressive enough to allow the solder to wet towards the tab. Few
no-clean fluxes reliably wet farther out than the exact spot where the
solder is originally deposited. (Generally, spread of a no-clean solder
deposit is due to slump, not wetting.)
Ryan Grant
-----Original Message-----
From: Mel Parrish [mailto:[log in to unmask]]
Sent: Monday, October 06, 2003 12:05 PM
To: [log in to unmask]
Subject: Re: [TN] Non Round BGA Pads
Hi Brian,
Phoenix x-ray presented to the 610 technical committee last week in MN.
The presentation included the concept of a tab added to the pad geometry
to support Automated X-Ray evaluation of BGA wetting. The idea as I see
it is to see if a graduated fillet occurs on the tab which can be
observed through x-ray evaluation. Seemed reasonable and the
illustrations used in the presentation supported the concept well. I
didn't see much discussion of the process on the web but try:
www.phoenix-xray.com
Best regards,
Mel Parrish
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Smith, Brian
(bsmith37)
Sent: Monday, October 06, 2003 12:23 PM
To: [log in to unmask]
Subject: [TN] Non Round BGA Pads
Good afternoon all. Could anyone out there point me towards some
articles/papers on using non-round pads for BGAs to improve X-ray
inspection? So far all I have been able to find are vague hints from
Bell Labs or IBM, but nothing substantial.
Thanks in advance!
Brian Smith
AMT
GCSD Harris Corporation
321-729-3808 (p) 321-729-7348 (f)
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