Hi Werner,

(1) Something I didn't realise before but it seems that the solder flows to
the terminations of the component not leaving enough solder on the pads to
make a good solderjoint.
(2) I'm not able to measure the height but the component is not elevated on
top of the solder.

(Thinking out loud) Will it be useful to increase the apertures of the
stencil so we can ad more paste? To make sure that when the flow to the
component is saturated there will still be enough solder on the pads to
make a good solderjoint.

Is this a common problem with Silver/Palladium?

Regards,
Hilbrand




-----Oorspronkelijk bericht-----
Van:    Werner Engelmaier
Verzonden:      maandag 1 september 2003 21:02
Aan:    [log in to unmask]
Onderwerp:      Re: [TN] Termination material

Hi H.,
The raises two questions:
(1) where did all the soolder go to?
(2) what is you solder joint heigth under the component?
Rework should certainly NOT be the norm.
And yes, any available Ag will go into solution with the Sn in the solder,
because of the dissolution rate.

Regards,
Werner Engelmaier

In a message dated 09/01/2003 2:43:20, [log in to unmask] writes:
>Hi Werner,
>There is practically no fillet height, the solder doesn't flow the way
>it should.
>If I ad some flux to the joint and reheat the solder the solderjoint is
>improving but it is still not that great.
>The best way to make a good solderjoint is to ad fresh solder during
rework.
>I was wondering if there is some truth in the reaction from Guy Ramsey
>that the Silver is leached into the Tin.

>H. Molema

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