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| Reply To: | TechNet E-Mail Forum. |
| Date: | Fri, 5 Sep 2003 10:40:06 -0600 |
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Hi Dave
We have had excellent feedback from our customers using 5 mil thick AMTX
E-FAB electroform Nickel stencils that we (Photo Stencil) provide for 16 mil
pitch and 20 mil pitch uBGA's. Paste transfer is better and cleaner for
this stencil compared to laser.
William E. Coleman
Vice President - Technology
Photo Stencil An ISO 9001 Registered Company
4725 Centennial Blvd.
Colorado Springs, CO 80919
Phone # 719-535-8528
Fax # 719-599-4334
Cell # 719-331-2433
email: [log in to unmask] <mailto:[log in to unmask]>
----------
From: Dave Chapman [SMTP:[log in to unmask]]
Sent: Friday, September 05, 2003 5:41 AM
To: [log in to unmask]
Subject: Re: [TN] stencil
Well, we have our first 16 mil fine pitch device, 128 pin QFP. I am
worried
about printing shorts on a 6 mil stencil. Everything else on the
board is 20
mil or better so 5 mil is not good idea. we normally do a 10%
reduction and
round the rectangles for better release. The pad width is .7 mil, I
would be
pushing 6 mil with the reductions, when our normal rule is on 20 mil
pitch
do not reduce overall width to less than 9. If I don't reduce the
width I'm
sure we will get shorts.
Am I going to have problems if we leave the width alone and only
take the
reduction in volume garnered by rounding the rectangles?
Dave C.
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